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9 February, 06:29

Which one of the following technologies in IC packaging provides the greater packing densities in circuit board assembly: (A) pin-in-hole technology, (B) surface-mount technology, or (C) through-hole technology

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  1. 9 February, 08:30
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    B) Surface mount technology provides the greater density in circuit board.

    Explanation:

    In the layout design of an printed circuit board (PCB) is required to consider:

    1. The size of the elements.

    2. The wire width (max, min).

    3. The clearance between the wires.

    Taking this into account, the benefits of using Surface Mount technology are: - the devices are smaller

    -can be soldered only on one layer (the other technologies needs 2 layers, one for the device and one for the pin)

    - the parasitic capacitance and resistance are smaller.
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